分销品牌_深圳市正润电子有限公司_分离式半导体_集成电路_连接器_射频半导体_嵌入式处理器_电容器_电阻器_电感器_传感器_LED照明电子器件_继电器_开关

分销品牌

A: A-BRIGHTInc; A-DataTechnology; AdvancedPowerElectronicsCorp.; A1PROsco.,Ltd.; AmericanAccurateComponents,Inc.; AAEONTechnology; AdvancedAnalogTechnology,Inc.; AavidThermalloy,LLC; ABCOELECTRONICSCO.LTD; ABCTaiwanElectronicsCorp; AbraconCorporation; ACCUTEKMICROCIRCUITCORPORATION; ACETechnologyCo.,LTD.; AppliedConceptsInc.; ActelCorporation; Active-Semi,Inc; AdvancedCrystalTechnology; AcutechnologySemiconductor; AdamTechnologies,Inc.; ADDtekCorp; AdvancedDigitalLogic,Inc.; AdvancedMonolithicSystems; AdvancedPowerTechnology; ADTech; AdvancedPhotonix,Inc.; AdvantechCo.,Ltd.; AnalogDevices; AEGISSEMICONDUTORESLTDA; AELCrystalsLtd; AeroflexCircuitTechnology; AgamemMicroelectronicInc.; AgereSystems; AnalogIntergrationsCorporation; AIMTEC; AimtronTechnology; AsahiKaseiMicrosystems; Alcoainternationalinc.; AdvancedLinearDevices; AllegroMicroSystems; Allen-Bradley; AlliedComponentsInternational; alphamicroelectronicsgmbh; AlphaIndustries; ALPSELECTRICCO.,LTD.; AllianceSemiconductorCorporation; Altechcorporation; AlteraCorporation; AltonicsCo.,Ltd.; AppliedMicroCircuitsCorporation; AdvancedMicroDevices; AMETHERMCircuitProtectionThermistors; AnalogMicroelectronics; AMICTechnology; AMISEMICONDUCTOR; AmkorTechnology; AmphenolCorporation; austriamicrosystemsAG; AnachipCorp; ANADIGICS,Inc; AdvancedAnalogicTechnologies; AnalogPower; AnarenMicrowave; AnpecElectronicsCoropration; Alpha&OmegaSemiconductors; APIDelevan; AplusIntergratedCircuits; ArchElectronicsCorp.; AriesElectronics,Inc.; ArtesynTechnologies; AdvancedSemiconductorBusinessInc.; ASIXElectronicsCorporation; AdvancedSemiconductor; ASMGmbH; AssmannElectronicsInc.; AstecAmerica,Inc; AstrodyneCorporation; ATMELCorporation; AdvancedTechnicalMaterialsInc.; AdvancedThermalSolutions,Inc.; AUKcorp; auris-GmbH; AustinSemiconductor; AVAGOTECHNOLOGIESLIMITED; AverLogicTechnologiesInc; AVGSemiconductors(HITEK); AvicTechnology; AVXCorporation; AdvancedXTALProducts; AZDisplays; AmericanZettler,Inc.; ArizonaMicrotek,Inc; ADATA Technology Co., Ltd; Advanced Monolithic Systems Inc.; Advanced Power Electronics Corp.; Avic Technology; AZ Displays, Inc.; Agilent(Hewlett-Packard)
B: B.B.BatteryCo.,Ltd.; BCDSemiconductorManufacturingLimited; BelFuseInc.; BeRexCorporation; BetLuxElectronics; Bitechnologies; BroadcomCorporation.; BocaSemiconductorCorporation; Bolymin,Inc; Bookham,Inc.; BOSERTechnologyCo.,Ltd; BothhandUSA,LP.; BedfordOptoTechnologyLtd.; BournsElectronicSolutions; BOWEIIntegratedCircuitsCO.,LTD.; BOWINELECTRONICCO.; BRIGHTLEDELECTRONICSCORP; BrillianceSemiconductor; BroadbandTelComPower,Inc.; BudIndustries,Inc.; Burr-BrownCorporation; BrightViewElectronicCo.,LTD.; BaumerIVOGmbH&Co.KG
C: CirrusLogic; CadekaMicrocircuitsLLC.; CaliberElectronicsInc.; CaliforniaMicroDevicesCorp; Calogic,LLC; CAMBIONElectronicComponents; C&DTechnologies; CanopusElectronics(H.K.)Ltd.; CatalystSemiconductor; CornellDubilierElectronics; CompensatedDeuicesIncorporated; ContinentalDeviceIndiaLimited; celduc-relais; CaliforniaEasternLabs; CentralSemiconductorCorp; CeramateTechnical; Chino-ExcelTechnology; ChampionMicroelectronicCorp.; CHENG-YIELECTRONICCO.,LTD.; ChenmkoEnterpriseCo.Ltd.; CherrySemiconductorCorporation; ChinaSemiconductorCorporation; ChinfaElectronicsInd.Co.,Ltd.; CHONGQINGPINGYANGELECTRONICSCO.,LTD; CirrusLogic; CITIZENELECTRONICSCO.,LTD.; CITRelay&Switch; C&KComponents; ClairexTechnologies,Inc; Clare,Inc.; C-MediaElectronics; CMLMicrocircuits; ChicagoMiniatureLamp,inc; Coilcraftlnc.; ComchipTechnology; ComsetSemiconductor; CONECElektronischeBauelementeGmbH; ConexantSystems,Inc; Connor-WinfieldCorporation; CooperBussmann,Inc.; COSMOElectronicsCorporation; CotoTechnology; Communications&PowerIndustries,Inc.; CraneAerospace&Electronics.; Cree,Inc; CrydomInc.,; CrystekCorporation; CRYSTEKCORPORATION; CSBBatteryCo.,Ltd.; CompactTechnologyCorp.; CTSCorporation; CentralTechnologies; CUIINC,; CWIndustries; CymbetCorporation; Cynergy3Co; CypressSemiconductor; Cyrustekcorporation; CystechElectonicsCorp.; ChangzhouShunyeElectronicsCo.,Ltd.
D: DaesanElectronicsCorp.; DaewooSemiconductor; DAICOIndustries,Inc.; DallasSemiconductor; DataDelayDevices,Inc.; DatatronicDistribution,Inc.; DavicomSemiconductor,Inc.; DayaElectricGroupCo.,Ltd.; DBLectroInc; DcComponents; DigitalCoreDesign; DDKLtd.; DIOTECElectronicsCorporation; DeltaElectronics,Inc.; DialightCorporation; DiodesIncorporated; DiotechCompany.; DiotecSemiconductor; DOMINANTSemiconductors; Dubilier; DynexSemiconductor; DENSEI-LAMBDA
E: ElektronComponentsLtd.; E-SWITCH; ebm-papst; EcliptekCorporation; ECMElectronicsLimited.; ECS,Inc.; EdalIndustries,Inc.; Electronicdevicesinc.; ElectronicFilmCapacitors,Inc.; EichhoffElectronics,Inc.; EICdiscreteSemiconductors; ElantecSemiconductor; ELMTechnologyCorporation; ELMOSSemiconductorAG; ELMElectronics; ElpidaMemory; EmcoreCorporation; ELANMicroelectronicsCorp; EmersonNetworkPower; EmergingMemory&LogicSolutionsInc; EMMicroelectronic-MARINSA; Energizer; Enpirion,Inc.; EonSiliconSolutionInc.; EorexCorporation; EPCOS; EsprosPhotonicscorp; EPIGAPoptoelectronicGmbH; EpsonToYoCom; EpsonCompany; Ericsson; EliteSemiconductorMemoryTechnologyInc.; ESSTechnology,Inc; EstekElectronicsCo.Ltd; ETALGroup; E-TechElectronicsLTD; ETRI; EtronTechnology,Inc.; EudynaDevicesInc; eupecGmbH; EUROQUARTZlimited; EutechMicroelectronicsInc; EverlightElectronicsCo.,Ltd; ExarCorporation; ExcelicsSemiconductor,Inc.; ExcelSemiconductorInc.; ExtechInstrumentsCorporation.
F: Fair-RiteProductsCorp.; FairchildSemiconductor; FaradayTechnology; FCIconnector; FirstComponentsInternational; FerroxcubeInternationalHoldingB.V.; FERYSTERInductiveComponentsManufacturer; FIDELIX; FiltranLTD; FiltronicCompoundSemiconductors; Finechips; FinisarCorporation.; FeatureIntegrationTechnologyInc.; FormosaMS; FOSLINKSEMICONDUCTORCO.,LTD; FoxElectronics; FreescaleSemiconductor,Inc; FrequencyDevices,Inc.; FrontierElectronics.; FutureTechnologyDevicesInternationalLtd.; FujikuraLtd.; FujitsuComponentLimited.; FujiElectric; Future Designs, Inc.
G: GalaxySemi-ConductorHoldingsLimited; GETE ELECTRONICS CO.,LTD; G24Innovations; GalaxyPower,Inc.; Gamewell-FCIbyHoneywell; GammaMicroelectronicsInc.; GeneralElectricCompany; GeneralCableTechnologiesCorporation; GENESYSLOGIC; GennumCorporation; GESolidState; GeneralSemiconductor; GHzTechnology; GilwayTechnicalLamp; Glenair,Inc.; GlobalMixed-modeTechnologyInc; GolledgeElectronicsLtd; GOOD-ARKElectronics; GreenPowerSolutionssrl; Grayhill,Inc; GREATECS; GunterSeniconductorGmbH.; GSITechnology; GuilinStrongMicro-ElectronicsCo.,Ltd.; GTMCORPORATION; GulfSemiconductor; GuangdongKexinIndustrialCo.,Ltd; GSIGroup,Inc.
H: HamamatsuCorporation; HAMLINPositionandMovementSensorSolutions; HANAMICRON; HanbitElectronicsCo.,Ltd; Hantronix,Inc; HarrisCorporation; HarwinPlc; HBHMicrowaveGmbH; HBElectronicComponents; HindRectifiersLimited.; HiroseElectric; HitachiMetals,Ltd; HitachiSemiconductor; HITRONELECTRONICSCORPORTION; HittiteMicrowaveCorporation; HoltekSemiconductorInc; HoltIntegratedCircuits; HolyStoneInternational; HoneywellSolidStateElectronicsCenter; HongfaTechnology; Hi-SincerityMocroelectronics; HTCKoreaTAEJINTechnologyCo.; Humirel; HighVoltagePowerSolutions,Inc.; HVViSemiconductors,Inc.; Hexawave,Inc; HYESOptoelectronics,Inc.; HynixSemiconductor; HYELECTRONICCORP.
I: IC-HausGmbH; ICMICROSYSTEMS; IntegratedCircuitSolutionInc; IntegratedCircuitSystems; IDEA.lnc.; IntegratedDeviceTechnology; IKSemiconCo.,Ltd; IllinoisCapacitor,Inc.; ILSIAmericaLLC; ImpalaLinearCorporation; IMP,Inc; InfineonTechnologiesAG; InnovASIC,Inc; IntegralCorp.; IntelCorporation; InterFETCorporation; Interpionsemiconductor; InterpointCorporationCompany; IntersemaSensoricSA; IntersilCorporation; IntronicsPower,Inc.; IPSEMICONDUCTORCO.,LTD.; IRC-aTTelectronicsCompany.; InternationalRectifier; IronwoodElectronics.; IsahayaElectronicsCorporation; InchangeSemiconductorCompanyLimited; ISOCOMCOMPONENTS; IntegratedSiliconSolution,Inc; ITETech.Inc.; IntegratedTechnologyFuture; ITTIndustries; IXYSCorporation; Intelligent Analog
J: JapanAviationElectronicsIndustry,Ltd.; JauchQuartzGmbh; JDSUniphaseCorporation; JFWIndustries,Inc.; JinanGudeElectronicDevice; JewelHillElectronic; JianghaiEuropeGmbH; JiangsuChangjiangElectronicsTechnologyCo.,Ltd; JIEJIEMICROELECTRONICSCO.,Ltd; JinanJingheng(Group)Co.,Ltd; JLWorldCompanyLimited.; JMKInc.; JohansonTechnologyInc.; JILINSINO-MICROELECTRONICSCO.,LTD.
K: KingblillionElectronicsCo.,Ltd.; KEC(KoreaElectronics); KemetCorporation; KepontElectronics,Inc.; KingborTechnologyCo; KingbrightCorporation; KnowlesElectronics; KnoxSemiconductor,Inc; KOASpeerElectronics,Inc.; KODENSHIKOREACORP.; KRElectronics,Inc.; KyoceraKinsekiCorpotation
L: ListofUnclassifedManufacturers; ListofUnclassifedManufacturers; ListofUnclassifedManufacturers; LANSDALESemiconductorInc.; LatticeSemiconductor; LEDTRONICS,INC; LEM; LGSemiconCo.,Ltd.; LIGITEKelectronicsco.,ltd.; LineagePowerCorporation; LinearIntegratedSystems; LinearDimensionsSemiconductor; LinearTechnology; LinkComManufacturingCo.,Ltd.; Lite-OnTechnologyCorporation; Littelfuse; LOGICDevicesIncorporated; LeshanRadioCompany; LSIComputerSystems; LuckyLightElectronic; Lumberg; LUMEXINC.; LumiledsLightingCompany; LuminsInc.; LUXPIA; LevelOne; LyontekInc.; LowpowerSemiconductorinc
M: M/A-COMTechnologySolutions,Inc.; MagnetrolInternational,Inc.; MajorLeagueElectronics; Make-Ps; Malloryperformanceclub; MarktechCorporate; MarlInternationalLimited; MarvellTechnologyGroupLtd.; MicroAnalogsystems; MaximIntegratedProducts; MaxwellTechnologies; MicroCommercialComponents; MacronixInternational; MDESemiconductor,Inc.; MiconDesignTechnologyCorporation; MeanWellEnterprisesCo.,Ltd.; MederElectronic; MegawinTechnologyCo.,Ltd; MelexisMicroelectronicSystems; MerrimacIndustries,Inc.; MicrelSemiconductor; MicroElectronics; MicroLinearCorporation; MicrochipTechnology; MICOROCRYSTALSWITZERLAND; Micronas; Micronetics,Inc.; MicronTechnology; MicropacIndustries; MicrosemiCorporation; MicrossComponents; Microtune,Inc; MICGROUPRECTIFIERS; Mill-MaxMfg.Corp.; MimixBroadband; MinilogicDeviceCorporationLimited; Mini-Circuits; MinmaxTechnologyCo.,Ltd.; MitelNetworksCorporation; MitsubishiElectricSemiconductor; MitsumiElectronics,Corp.; MMDComponents; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexElectronicsLtd.; MolexKits; MolexElectronicsLtd.; MORNSUNScience&TechnologyLtd.; MOSAIC; MOSAELECTRONICS; MoselVitelic,Corp; MospecSemiconductor; Motorola,Inc; MicroPowerDirect,LLC; M-pulseMicrowaveInc.; MPSIndustries,Inc.; MonolithicPowerSystems; MRVCommunications,Inc.; M.S.KennedyCorporation; MTRONPTI; MTUOnsiteEnergyCorporation; MurataPowerSolutionsInc.; MurataManufacturingCo.,Ltd.; MUSICSemiconductors
N: NingboForyardOptoelectronicsCo.,Ltd.; NainaSemiconductorltd.; Nais(MatsushitaElectricWorks); NanoAmpSolutions,Inc.; NIHONDEMPAKOGYO; NEC; NelFrequencyControls,inc; NewhavenDisplayInternational,Inc.; NICHIACORPORATION; Nichiconcorporation; NIC-ComponentsCorp.; NihonInterElectronicsCorporation; NationalInstrumentsCorporation; NewJapanRadio; NewJerseySemi-ConductorProducts,Inc.; NihonKaiheikiIndustryCo.Ltd.; NipponPrecisionCircuitsInc; NationalSemiconductor; NTEElectronics; NumonyxB.V; NXPSemiconductors; NXPSemiconductors; NuvotemTalema
O: OptoElectronicsCo,.LTD; OENIndiaLimited; OhmiteMfg.Co.; OkayaElectricAmerica,Inc.; OKIelectroniccomponets; OmniVisionTechnologies,Inc.; OmronElectronicsLLC; ONSemiconductor; OPLINKCommunicationsInc.; Opnext.Inc.; OPTEKTechnologies; OpticommCorporation; OptoDiodeCorp; OptoSupplyInternational; OptowayTechnologyInc; OPTREXCORPORATION; ORIONFANS; OristerCorporation; OSAOptoLightGmbH; OscilentCorporation; OSRAMGmbH; OTAXCorporation; OxfordSemiconductor
P: PowerMateTechnologyCo.,LTD; P-tecCorporation; PACELEADERINDUSTRIAL; PacificSiliconSensor,Inc.; PowerAnalogMicoelectronics; PanasonicSemiconductor; PANDUITCORP.; PanJitInternationalInc.; PARALIGHTELECTRONICSCO.,LTD.; PCAELECTRONICSINC.; PREMIERDEVICES,INC.; PEAKelectronicsGmbH; PEAKPlastic&MetalProductsLTD.; PeregrineSemiconductorCorp.; PericomSemiconductorCorporation; PerkinElmerOptoelectronics; PETERMANN-TECHNIK; PhihongUSAInc.; PHOENIXCONTACT; PickerComponents; PowerICLtd.; PICGmbH; PixartImagingInc.; Pletronics,Inc.; PhaseLinkCorporation; PLXTechnology; PMC-Sierra,Inc; PremierMagnetics,Inc.; PowerInnovationsLtd; PolyfetRFDevices; PomonaElectronics; PowerSemiconductors; PotatoSemiconductorCorporation; Power-One; PowerSystemsGmbH+Co.KG; Powerbox; PowerexPowerSemiconductors; PowerIntegrations,Inc.; PowersemGmbH; PowertipTechnology; Precid-DipDurtalSA; PREMOCORPORATIONS.L; ProductwellPrecisionElect.CO.,LTD; ProtechSystemsCo.,Ltd.; ProtekDevices; PrincetonTechnologyCorp; ProjectsUnlimited,Inc.; PulseCoreSemiconductor; PulseATechnitrolCompany; PurdyElectronicsCorporation; PyramidSemiconductorCorporation
Q: QuanzhouJinmeiElectronicCo.,Ltd.; QimondaAG; QTOptoelectronics; QUALCOMMIncorporated; QualtekElectronicsCorporation; QuantumResearchGroup; QUARTZCOMthecommunicationscompany
R: RugaoDachangElectronicsCo.,Ltd; RadiometrixLtd; RAIOTechnologyInc.; RalstonInstruments.; RaltronElectronicsCorporation; RamtronInternationalCorporation; R&EInternational,Inc.; RaytheonCompany; RCDCOMPONENTSINC.; RDCSemiconductor; RecomInternationalPower; RectronSemiconductor; RenesasTechnologyCorp; RFEinternational; RFHIC; RFMicroDevices; RFMonolithics,Inc; rfsolutions.ltd; RhombusIndustriesInc.; RHOPOINTCOMPONENTS; Richco,Inc.; RichtekTechnologyCorporation; RICOHelectronicsdevicesdivision; RiedonPowertron; RMTLtd.; Rohm; RoithnerLaserTechnikGmbH; ReedRelaysandElectronics; RSGElectronicComponentsGmbH; RUBYCONCORPORATION; RuichipsSemiconductorCo.,Ltd
S: SHANGHAIBELLINGCO.,LTD.; ShanghaiLunsureElectronicTech; ShenzhenJinYuSemiconductorCo.,Ltd.; SHANTOUHUASHANELECTRONICDEVICESCO.,LTD; ShenZhenJingHandaElectronicsCo.,Ltd.; SHENZHENKYLCOMMUNICATIONEQUIPMENTCO,LTD.; ShenzhenPingShengElectronicsCo.,Ltd.; Sames; SamHopMicroelectronicsCorp.; Samsungsemiconductor; SAMWHAELECTRIC; Sankenelectric; SanRexCorporation; SanyoSemiconDevice; Savantic,Inc.; SCHOTTCORPORATION; SchurterInc.; SeawardElectronicsInc.; SeCoSHalbleitertechnologieGmbH; SemeLAB; SemicoaSemiconductor; SemiHowCo.,Ltd.; SemikronInternational; SemiWellSemiconductor; SEMPOELECTRONICLimited; SemtechCorporation; SEMTECHELECTRONICSLTD.; Sensitron; SensortechnicsGmbH; SeoulSemiconductor; ShengbangMicroelectronicsCo,Ltd; SharmaElectroComponents,Inc; SharpElectrionicComponents; SHIELDs.r.l.; ShindengenElectricMfg.Co.Ltd; ShoulderElectronicsLimited.; SiemensSemiconductorGroup; SiGeSemiconductor,Inc.; SeikoInstrumentsInc; SiliconLaboratories; SilanMicroelectronicsJoint-stock; Siliconimage; SilikronSemiconductorCo.,LTD.; SilonexInc.; SimtekCorporation; SIPATCo,Ltd; SipexCorporation; SirectifierSemiconductors; SirectifierGlobalCorp.; SIRENZAMICRODEVICES; SiliconTouchTechnologyInc.; SitronixTechnologyCo.,Ltd.; SIXNETTechnologyPark; SkyworksSolutionsInc.; SystemLogicSemiconductor; SMSCCorporation; SobertonInc.; Sonardynesoundindepth; SONiXTechnologyCompany; SonyCorporation; SourcePhotonics,Inc.; SPANSION; SpectraLinearInc; SpectrumMicrowave,Inc.; SparklePowerInc.; SiliconStandardCorp.; SolidStatesDevices,Inc; ShanghaiSunriseElectronics; SolidStateOptronic; SiliconStorageTechnology,Inc; StanfordMicrodevices; STANLEYELECTRICCO.,LTD.; StansonTechnology; STATEKCORPORATION; STATSChipPAC,Ltd.; StealthMicrowave,Inc.; STMicroelectronics; SumidaCorporation; SummitMicroelectronics,Inc.; SunLEDCorporation; ShenzhenSunnywayBatteryTechCo.Ltd.; SuntacElectronicCorp.; SuntanCapacitors; SuperworldElectronics; SurgeComponents; Supertex,Inc; SUYINUSA,INC.; Switchcraft,Inc.; SYNCPOWERCrop.; SyncMOSTechnologies,Inc; SYNERGYMICROWAVECORPORATION; SynQorWorldwideHeadquarters; SynSemi,Inc.; Systemsensoradvancedideas.; Santa Cruz Biotechnology, Inc.; ShenzhenWinsemiMicroelectronicsCo.,Ltd
T: TheABBGroup; TycoElectronics; TECHNOLOGYASSISTANCEBCNA2010,S.L.; TachyonicsCO,.LTD; TAI-SAWTECHNOLOGYCO.,LTD.; TAITRONComponentsIncorporated; TaiyoYuden(U.S.A.),Inc; TakCheongElectronics(Holdings)Co.,Ltd; TEXASADVANCEDOPTOELECTRONICSOLUTIONS; TDKElectronics; TeccorElectronics; TelComSemiconductor,Inc; TeledyneTechnologiesIncorporated; TRANSYSElectronicsLimited; TEMEX; TEMICSemiconductors; TensilityInternationalCorp.; TeridianSemiconductorCorporation; TigerElectronicCo.,Ltd; ThermtrolCorporation; THineElectronics,Inc.; ThinkingElectronicIndustrialCo.,Ltd; THORcommunications; TexasInstruments; TexasInstruments; TaiwanMemoryTechnology; TOCOSAMERICA,INC.; TokenElectronicsIndustryCo.,Ltd.; TOKO,Inc; TontekDesignTechnology; TopstekInc.; TorexSemiconductor; ToshibaSemiconductor; TotalPowerInternational; TouchstoneSemiconductorInc; TRACOElectronicAG; TranscendInformation.Inc.; Transcom,Inc.; TRIADMAGNETICS; TRINAMICMotionControlGmbH&Co.KG.; TripathTechnologyInc.; TriQuintSemiconductor; TransysElectronics; TumblerTechnologies+TRUMPower; TaiwanSemiconductorCompany,Ltd; Traco Electronic AG
U: UnitedChemi-Con,Inc.; UMCCorporation; UnitedMonolithicSemiconductors; UnictronTechnologiesCorporation; UNIOHMCORPORATION; UNISEM; UnityOptoTechnology; UshaIndiaLtd.; UnisonicTechnologies
V: VishayTelefunken; VaishaliSemiconductor; VanlongTechnologyCo.,Ltd.; Varitronixinternationallimited; VectronInternational,Inc; VestalElectronicDevices,LLC; VicorCorporation; Vincotech; VishaySiliconix; VitesseSemiconductorCorporation; VoltageMultipliersInc.; VanguardInternationalSemiconductor; VolgenKagaElectronicsInc.; VirginiaPanelCorporation; VTItechnologies; Vishay Siliconix
W: WuxiNCEPowerSemiconductorCo.,Ltd; WallIndustries,Inc.; WhiteElectronicDesignsCorporation; WeidaSemiconductor,Inc.; Weidmuller; WeitronTechnology; WeltrendSemiconductor; WelwynComponentsLimited; WillowTechnologiesLtd; Winbond; WingShingComputerComponents; WinsonSemiconductorCorp.; WisdomtechnologiesInt`l; WJCommunication.Inc.; WolfgangKnap; WolfsonMicroelectronicsplc; Won-TopElectronics; WurthElektronikGmbH&Co.KG,Germany.; WuxiYoudaelectronicsCo.,LTD
X: XianSemipowerElectronicTechnologyCo.,Ltd.; XFMRSInc.; XicorInc.; Xilinx,Inc; XPPowerLimited
Y: YAMAHACORPORATION; YamaichiElectronicsCo.,Ltd.; YamarElectronicsLtd.; Yangzhouyangjieelectronicco.,ltd; YENYOTECHNOLOGYCo.,Ltd; YEONHOELECTRONICS; YOBONTECHNOLOGIES,INC.; YellowStoneCorp; YUXIANGMagnetcmaterialsInd.Co.,Ltd.
Z: ZarlinkSemiconductorInc; Z-Communications,Inc; ZetexSemiconductors; ZETTLERElectronics; Zilog,Inc.; ZentrumMikroelektronikDresdenAG; ZoranCorporation; ZowieTechnologyCorporation